-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTAI Highlights New Technologies, Programs
July 11, 2007 |Estimated reading time: 4 minutes
ORLANDO, Fla. The SMTA plans to debut several programs from tutorials to an exhibition at SMTA International (SMTAI) in Orlando, October 711, 2007. The program includes a keynote from Andrew Alduino, panel discussions, an informal "chat" program on the show floor, and other events designed to help attendees gather and share information, and network with constructive industry partners.
The SMTAI program offers more than 100 technical papers, and more than 130 exhibitors in the inaugural SMTAI Electronics Exhibition, held October 910. Technical sessions will occur over the same two days. On Sunday, Monday, and Thursday, SMTAI hosts 26 half- and full-day tutorials, 16 of which feature newly developed syllabi.
SMTAI's opening session, Tuesday, October 9, focuses on "SMTA's End Game: Lead-out, Labels-on, Reliability-in." Steve Greathouse, Greathouse Solutions, LLC, will lead a discussion of markings, symbols, and labeling assemblies for lead-free compliance and identification. Werner Engelmaier, Engelmaier Associates LC, will explore lead-free PCB reliability. SMTA will congratulate winners of 2006 conference awards during this session. Best of conference presentation went to Dave Hillman of Rockwell Collins; best proceedings paper recognizes Robert Darveaux, Ph.D., from Amkor Technology; and Heather McCormick of Celestica, Inc., will receive an award for best international paper.
Andrew Alduino, senior optical researcher at Intel Corporation's Photonics Technology Lab, will keynote the SMTA annual meeting October 10, with a discussion of implementation challenges in future optical assemblies. Thermal management, multi-chip packaging (MCP), component alignment, and other concerns will be addressed. SMTA Association Awards will go out during the meeting, recognizing members that dedicate time, expertise, and energy to the organization and the industry. The Charles Hutchins Educational Grant will be announced as well, awarding $5,000 for packaging or interconnect research to a graduate-level student, in memory of industry contributor Charles Hutchins.
"The Heat Is Off," Tuesday October 9, a thermal management panel moderated by Gail Flower, editor-in-chief, SMT Magazine, will approach thermal management for miniaturized, high-density assemblies from a design, software, and materials standpoint. Panelists include Sherman Ikemoto, Flometrics; Jordan Ross and Karthik Vijayamadhavan, Indium Corporation; Alan Rae, Ph.D., NanoDynamics; and Brian Toleno, Ph.D., Henkel Technologies. They will debate methods for controlling heat at die, package, and board levels.
SMTAI's program includes three major symposia focused on manufacturing and assembly, advanced packaging, substrates, soldering, process control, and contract manufacturing and other business issues. The Contract Manufacturing Symposium, Tuesday October, will examine unnecessary costs in the supply chain and ways to optimize service delivery in the EMS business. The Lead-free Symposium, Thursday October 11, comprises papers on solder joint reliability with SAC alloy variants, iNEMI initiatives, advances in lead-free reliability, and case studies on the subject. A plenary session will provide a China RoHS update. The debut of the Global RoHS Symposium will address the "RoHS Revolution," and environmental compliance for electronics manufacturers, on the 8th.
SMTA organized a series of daily, informal chats on the show floor, October 910 at SMTAI, with attendees and industry experts. Chats will focus on a specific topic, but will not follow a pre-set agenda and are open to all. SMTA hopes to foster greater dialogue within the industry and personal networks with the introduction of such informal sessions.
The Evolving Technologies Summit, Monday October 8, will draw from three paper sessions and a panel discussion to explore trends in electronics assembly and manufacturing, with a focus on advanced materials for lead-free processing, embedded chip packaging, and packaging interconnect reliability. The panel, moderated by Irene Sterian of Celestica, Inc., will feature participants from the industry and will include audience and moderator queries. Some papers to catch at the Summit include an investigation of lead-free nano-solder paste microstructure, an assessment of board-level adhesives, elimination of flip-chip electromigration failures using embedded chip build-up technology, a look at 3-D wafer-level system-in-package (SiP) interconnects formed with through-silicon vias (TSVs), a report on build-up BGA package reliability, copper bonding presented as a viable solution in IC packaging, and a discussion on optimizing chip-on-board (COB) assembly. For a full list of papers given at the Summit, visit the SMTAI Website.
New in 2007, SMTAI will host the Bob Willis "Process Advice and Defect Clinic," in the exhibit hall. Attendees can email failure analysis, defect, or other related questions to the SMTA prior to the show, listing "Process Advice & Defect Clinic" in the subject line. The best or most interesting process problem or question will be selected for a prize package, including interactive lead-free training material, an X-ray inspection and defect guide, and helpful wall charts. All attendees are invited to pick up a "Process Defect Guide" leaflet at the clinic. Bob Willis is an international consultant, lead-free auditor, and SMTA tutorial instructor.
Exhibitors at SMTAI can email Meredith Courtemanche, mcourtemanche@pennwell.com, at SMT with a short product summary and a high-resolution image of the product to be featured at SMTAI. We will highlight tradeshow products in our September SMTAI preview.
Other events to visit at SMTAI include iNEMI's roadmap meetings and discussions; sessions on revenue-based recycling and regulatory marking; and meetings covering substrate challenges, quality assurance in package and PCB assemblies, and other topics. For details on any of the sessions or to register for the show, visit www.smta.org.