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Adhesive for Flip Chip BGAs
June 28, 2007 |Estimated reading time: Less than a minute
MIDLAND, Mich. The DA-6534 one-part, high-performance thermal adhesive from Dow Corning Corporation uses silver filler with a silicone-based chemistry to offer flexibility, reliability, and thermal conductivity.
It targets thermal management for flip-chip BGAs and other advanced components. The adhesive maintains elasticity at high and low temperatures and features thermal resistance of 0.09 cm2 C/W at 24 µm. Due to a hydrosilylation reaction of vinyl polymers and a hydrogen cross-linker, the thixotropic material is completely inert, and does not produce byproducts. It is said to be dispensed easily; bondline thickness (BLT) is controlled via pressure and time. Cure is controlled with heat.