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Paste Volume Inspection Module
December 31, 1969 |Estimated reading time: Less than a minute
The VP3 paste inspection module offers in-line 3-D solder paste inspection, measuring and evaluating paste volume, height, shape, smears, and other characteristics. It incorporates isotropic polychromatic fringe projection technology to illuminate paste deposits and provide reportedly high accuracy at line speeds.
The isotropic polychromatic fringe lighting uses special light patterns and colors projected across the printed PCB from three directions. This technique is said to allow multiple image capture and eliminate object-orientation error causes. Full-surface inspection qualifies defect features such as missing paste, smearing or short circuits, paste height and volume, and topography. Height resolution equals <1 µm for fine-pitch apertures, such as those for BGAs or flip chips.
The inspection system recognizes systematic and sporadic defects, optimizing printer use. The sensor head does not contain moving parts, which reportedly extends sensor life in production environments. Viscom, Hanover, Germany, www.viscom.com.