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Lead-free High-tack Flux
December 31, 1969 |Estimated reading time: Less than a minute
TSF-6592LV lead-free no-clean tacky soldering flux is a high-tack paste flux that minimizes skewing with BGAs, CSPs, flip chips, or other surface-mount devices. It suits flip chip attach, rework and repair, sphere and ball attach, and lead-free reflow.
The flux reportedly leaves shiny solder joints with clear, non-tacky residue after air or nitrogen reflow. It is designed to accommodate rework applications. Peak reflow temperature reaches 270°C. The product is reportedly aggressive on OSP-Cu substrates, immersion finishes, and electroplated nickel immersion gold (ENIG) surface finishes. It was designed for high-speed printing from screen and stencil, rotating drum, slide fluxer, and syringe dispensing systems. Kester, Itasca, Ill., www.kester.com.