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EI Enters Long-term DoD Contract
May 30, 2007 |Estimated reading time: Less than a minute
ENDICOTT, N.Y. Endicott Interconnect Technologies, Inc. (EI), received a $49 million follow-on production contract from the U.S. Department of Defense (DoD) for a new generation of packaging, PCB, and substrate technologies. The R&D will focus on high-productivity computing, and is part of a five-year agreement.
EI met DoD qualification requirements for PCB, module, and processing blade production, and will serve as a DoD research arm during the three-phase, five-year program. Preliminary work covers system development and initial PCB and substrate designs, and test vehicle fabrication to evaluate alternative materials sets. The second and third phases, with follow-on awards, will involve facility modifications to accommodate next-generation processing equipment, which will produce PCBs, substrates, assemblies, and other advanced technologies.
The long-term project will motivate EI to recruit scientists and engineers, develop new processes, technologies, and techniques, and invest in leading-edge R&D, said Rajinder Rai, VP of R&D at EI. The company reports about 25% of its sales come from the military/aerospace sector, and cites on-shore capacity and research as reasons for the DoD interest.