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Solder Paste Detection System
December 31, 1969 |Estimated reading time: Less than a minute
OPASS technology, designating offset placement after solder screen printing, addresses solder paste alignment errors during manufacturing. It detects and compensates for solder paste misalignment automatically, reducing the errors caused by forward expansion, scaling, contraction, and other process variables.
OPASS can correct problems with sensitive substrates such as ceramic and flex, contraction caused by reflow on double-sided boards, and low self-alignment capacity of lead-free solders. Components are centered on the printed paste rather than the designed location, which reportedly reduces defect rates. OPASS is designed to cost-effectively eliminate AOI and other inspection systems. Juki Automation Systems, Morrisville, N.C., www.jas-smt.com.