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Bill Coleman, Ph.D. Joins SMT Advisory Board
April 30, 2007 |Estimated reading time: 1 minute
NASHUA, N.H. — SMT Magazine welcomes William E. Coleman, Ph.D., of Photo Stencil (Colorado Springs, Colo.) to its Editorial Advisory Board, joining 12 other industry experts. The Board offers insight on the industry, future trends, and market technology. Coleman will write on the topic of Printing for the surface mount assembly industry.
William E. Coleman, Ph.D., is vice president of technology at Photo Stencil, a manufacturer of stencils and STM Tooling. In this position, Coleman works closely with customers to understand their printing requirements. He also serves as chairman of the IPC Stencil Design Guidelines Subcommittee 5-21e), and is a member of IEEE and SMTA. Coleman has presented Technical Stencil Design reviews to SMTA chapters globally, and has authored several technical papers on all facets of printing technology.
Coleman earned a BS in Physics from Wheeling Jesuit University, and an MS and Ph.D. in Physics from West Virginia University.
Other members of SMT's Editorial Advisory Board include:Board Design and Assembly: Vern Solberg, Tessera Technologies, Inc.Business Management: Gary Tanel, TechBiz ConsultingCleaning: Michael Konrad, Aqueous Technologies CorporationCleaning: Harald Wack, Ph.D., Zestron AmericaComponents: Craig Hunter, AVX CorporationDesign and Manufacturing: Ray P. Prasad, Ray P. Prasad Consultancy GroupElectronic Packaging and Assembly: Dennis Derfiny, Motorola, Inc.Fine-pitch: Robert Rowland, RadiSys CorporationGlobal Process Design: Evelyn Baldwin, 3M EMMDMaterials and Assembly: Laura Turbini, Ph.D., Research in MotionMaterials Science: Jennie S. Hwang, H-Technologies, Inc.Process Optimization: Ron Lasky, Indium Corporation of America