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SMT/Hybrid/Packaging Highlights
April 26, 2007 |Estimated reading time: 2 minutes
NUREMBERG, Germany SMT/Hybrid/Packaging, April 2426 in Nuremberg, hosts technical sessions, tutorials, exhibitions, live assembly lines, and other events geared toward advanced applications in packaging and electronics assembly. Following are some highlights from the show.
The VDI/VDE-IT production line showcases multifunctional packaging, a trend in electronics manufacturing. In Hall 7, this line and supporting demonstration islands are hosted by VDI/VDE, academia, and industry partners. In the "Optic Meets Electronic" station, Fraunhofer IZM and other companies demonstrate optoelectronic packages, modules, and assemblies; optical interface technologies and materials; production technologies; and other products.
The conference is supporting 27 half-day tutorials, nine of which are in English. In "Latest Developments in Component Soldering and Adhesive Technologies," Stefan Strixner, senior process engineer at ZESTRON Europe, presented work on surface requirements across the manufacturing process. Helmut Schweigart, Ph.D., head of application technology at ZESTRON Europe, led "Assembly Surface Analysis Prior to Coating," a tutorial on reliable coating applications. Zestron (Ingolstadt, Germany) is exhibiting at Booth 210.
Professor Wolfgang Scheel, Ph.D., of the Fraunhofer Institute for Reliablity and Microintegration; and Annemarie Biener, from FUBA Printed Circuits GmbH, chair a thermal management session, this year's highlighted topic. Ning-Cheng Lee, Ph.D., is lecturing on lead-free assembly, covering legislation; alloys, surface finishes, components, and substrates; and reflow and assembly. Lee is vice president of technology at Indium Corporation in Clinton, N.Y.
Kyzen Corporation (Nashville, Tenn.) exhibits AQUANOX A4625B in Booth 7-410. The aqueous cleaning chemistry for batch washers reportedly removes most flux residues including lead-free formulas. A4625B is environmentally friendly and supports long tank life. Kyzen also is exhibiting the Lonox L5611 aqueous-blend cleaner, which removes flux, solder paste, and uncured adhesives from stencils and misprints.
KIC (San Diego, Calif.) displays its KIC Vision, an automatic profiling system, at Booth 7-436. KIC VISION uses embedded sensors in the reflow oven to continuously monitor and report on process parameters. The company is also highlighting its 24/7 process monitor.
Europlacer (Dorset, U.K.) features its Finesse2 flexible medium- to high-volume placement system at Booth 7-410. With high-speed and fine-pitch capabilities, the system offers 198- × 8-mm feeder capacity and intelligent feeder technology. On-the-fly vision, 0201 to 50- × 50-mm QFP placement capability and smart nozzles also are standard. The company also is displaying its Stock Management intelligent inventory control system.
Speedprint Technology Ltd., a division of Blakell Europlacer Group, also in Dorset, U.K., demonstrates the SP200avi inline stencil printer at Booth 7-116. It features proprietary look-down/look-down vision alignment with twin roving cameras mounted on independent X/Y gantries to facilitate paste-on-stencil inspection.
FINETECH (Tempe, Ariz.), at Booth 9-337, debuts the FINEPLACER FEMTO to the European market. The FEMTO automates bonding applications for flip chips, MEMS and MOEMS, micro-optics and sensors, and other advanced packages. It features an enlarged work area, automated pattern recognition, and alignment based on X/Y/Z/Theta movement. With accuracy at ±0.5 µm, the machine suits production, product-development, and process-development environments. FINETECH will highlight the Micro Rework applications package for the Pico machine. This suite includes a local-area, hot-gas bottom heater; hot-gas reflow; motorized swivel module; high-magnification optics; and other tools.
BPM Microsystems (Houston, Texas) is displaying a full line of device programmers at booth 9-634. The programmers support NAND and NOR flash and include universal, concurrent programming, and fine-pitch automated models.