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Components & Pick-and-Place Equipment
December 31, 1969 |Estimated reading time: 1 minute
MYDATA, BPM, Assembléon, Practical Components, Universal Instruments, Manncorp, and WKK China are demonstrating innovations in pick-and-place and components at Nepcon Shanghai. High-mix and high-speed are key features.
MYDATA (Stockholm, Sweden), with Asian affiliate MYDATA Asia Pte. Ltd. (Singapore) is exhibiting the MY-Series Extended. This family of pick-and-place systems performs high-speed placement with a range of component sizes for high-mix/low- to mid-volume production. Visit MYDATA at Booth 1D30.
BPM Microsystems, based in Houston, Texas, is exhibiting its full line of device programmers at Booth 1C15, including universal programmers, concurrent programming systems, and fine-pitch automated programming systems. The programmers also provide NOR and NAND Flash support.
Assembléon Hong Kong is premiering the A-Series AX-201 pick-and-place machine. It suits fine-pitch and complex components in flexible manufacturing environments. Visit Assembléon at Booth 1B01.
Practical Components Inc., headquartered in Los Alamitos, Calif., is exhibiting in distributor KAL's booth 1B01. Practical Components will highlight dummy components including Amkor Technology package-on-package (PoP) stacked daisychain, PC200 PoP test board and kit, Dual Row MLF from Amkor Technology, and the PC2006 AIM print test board and kit.
Universal Instruments (Conklin, N.Y.) is featuring the Genesis GC-120Q platform. A quad-gantry machine, the pick-and-place system uses four Lightning heads for a maximum throughput of 120,000 cph. The machine places 30-mm2 to 01005 components for high-speed or high-mix assembly. Visit Universal Instruments at Booth 1F15.
Distributor Manncorp, out of Willow Grove, Penn., and San Diego, Calif., is exhibiting Autotronik-SMT's MC-384 pick-and-place system, which suits surface mount prototyping and other short- to medium-run applications, at Booth 2L02. The system features Cognex vision with head-mounted camera to permit non-contact, on-the-fly SMD alignment from 0201s through CSPs, microBGAs, flip chips, and other components up to 38 × 38 mm.
WKK China Ltd., headquartered in Hong Kong, is demonstrating the YG300 modular ultra-high-speed chip shooter. The system uses four independent X/Y modular units to achieve a mounting speed of 105,000 cph. Find WKK at Booth 1C15.