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Low-loss, High-rel Board Materials
April 23, 2007 |Estimated reading time: Less than a minute
PETERSBURGH, N.Y. Taconic's advanced dielectric division features several low-loss, high-reliability products for conventional and multilayer radio-frequency (RF) and high-speed digital board fabrication.
TacPreg prepregs are constructed with BT epoxy/woven fiberglass/PTFE components, and offer reduced electrical loss and easier fabrication for high-speed digital and RF commercial and military applications. Dimensionally stable, the laminates are available with 33.5 Dk and enable 20+ layers at FR-4 temperatures and pressures.
HyRelex, thin and flexible interconnect materials, offer thermal, mechanical, electrical, and moisture resistance for multilayer, double-sided, and rigid-flex boards. Features include a low dissipation factor, high peel strength, and a smooth surface profile to suit high-frequency, high-temperature, and harsh-environment boards.
Taconic will also highlight TSM-30, a low-loss, low-moisture, low-solvent-absorption product for a range of temperatures and frequencies; and heavy-metal-clad laminates with thick copper, brass, and aluminum layers for heat dissipation in multilayer boards. The company will exhibit these capabilities at the International Microwave Symposium (IMS), June 57 in Honolulu. For more information, visit our Events page.