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EIPC Focuses on Tech/Biz Strategies
April 19, 2007 |Estimated reading time: Less than a minute
MAASTRICHT, the Netherlands The European Institute of Printed Circuits (EIPC) summer conference, June 1415 in Edinburgh, U.K., will feature sessions on materials and technology, as well as business-oriented programs for companies interested in the EU's 7th Framework Program (FP7) and supply-chain issues.
High-density interconnect (HD) will remain a prominent topic, covered in PCB fabrication technology presentations as well as advanced plating sessions. A session on solderable surface finishes will feature information on immersion silver and an organic nano-metal for advanced immersion tin. Design-for-manufacture (DfM) talks will look at embedding technologies, tightening design specs, and managing communication throughout the supply chain.
Management sessions will focus on taking advantage of R&D funding and other opportunities from the FP7, while another session will feature a business outlook on the global electronics industry. Market trends, RoHS, "green" technologies, and other environmental topics will be discussed in several presentations. For more information and to register, visit www.eipc.org or our Events page.