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"Green" Bioplastic Offers Thermal Management
April 18, 2007 |Estimated reading time: Less than a minute
TOKYO NEC Corporation developed a bioplastic from plant-based material and carbon fiber that demonstrates higher heat-conductivity than stainless steel. The bioplastic meets strength and moldability requirements for use in electronic products, according to NEC, and was developed at the company's fundamental and environmental research laboratories.
Carbon fiber and a binder create a cross-linked structure in a polylactic acid (PLA) resin, which results in a material with high heat-diffusion properties and good conductivity in the plane direction of the PLA resin board. The biomass ratio exceeds 90%, reportedly making the product environmentally sound.
It is said to avoid limitations found in conventional heat-release products, such as prohibitive form factor, high density and cost, low heat conductivity, and hot spots on the housing of electronics at the user interface. The composite releases heat generated by electronic parts and assemblies across the housing's surface and is designed to slow temperature increases within the device. It is included in a mobile phone commercialized by NEC, and is expected to go into mass production by the end of March 2009.