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Next-gen Tools Improve Wave Soldering
March 14, 2007 |Estimated reading time: Less than a minute
FRANKLIN, Mass. The Electrovert VectraES wave solder system from Speedline Technologies provides flexibility with next-generation fluxer, preheat, and solder-module options and controls. The system enables both lead-free and tin/lead soldering.
A servo-controlled reciprocating spray fluxer, ServoSpray, comprises an air-atomized spray head, pressurized tank system, and self-cleaning nozzle. It can spray in one direction or bilaterally, according to recipe controls, and is said to spray uniformly with a variety of flux formulas.
Low-mass forced convection in the preheat stage reportedly improves thermal performance with a one-piece module. It can minimize cross-board and top-to-bottom temperature differentials to maintain consistent surface mount and thru-hole soldering temperatures.
The solder nozzle includes the UltraFill system, which targets process challenges in lead-free soldering. The system is 40% wider than Electrovert's tin/lead nozzles, and provides increased contact and dwell times. Dual wave recipes reportedly benefit from a reduced gap from chip to main wave. A shroud feature lets operators use the nozzle in air and nitrogen configurations. The company reports improved hole fill, reduced bridging, and minimized dross generation with the next-generation nozzle.