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Laser System Cuts Polyimide and Flex
March 2, 2007 |Estimated reading time: Less than a minute
WILSONVILLE, Ore. The MicroLine UV from LPKF cuts openings in polyimide coverlayer foils and flex circuits, performing routing, skiving, drilling, pocket cutting, etch/solder-resist structuring, and ceramic substrate micromachining. It suits prototyping and pre-series production environments.
The compact laser system incorporates a next-generation high-speed linear drive for greater positioning accuracy, higher production speeds, and faster acceleration. It also features multiple tools for versatile, flexible manufacturing demands, and is said to reduce product changeover times.