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Partnership Yields Medical Assembly
March 1, 2007 |Estimated reading time: 1 minute
ENDICOTT, N.Y. Endicott Interconnect Technologies (EI) entered into a manufacturing services agreement with a intravascular ultrasound (IVUS) catheter manufacturer, through a process development and manufacturing partnership with Unovis-Solutions. In the two-year, $3.9 million contract, EI will develop and manufacture flexible substrates and assemble flip chips for the substrates.
The advanced process lab at Unovis developed and automated manufacturing processes for the technology, said James McNamara, president and CEO of EI. Unovis recommended EI to the end customer for the project, due in part to EI's substrate capabilities, added George Westby, director of the Unovis advanced process lab. Unovis provided process- and equipment-implementation guidelines for volume production, and EI purchased a Unovis GSMxs flip-chip placement system for the project. The system features advanced linear motors, high-resolution cameras, and assembly options to suit the high-quality, high-yield parameters of the device.
The flip-chip assembly comprises a miniature polyimide flex substrate with fine-pitch, 14-µm lines and spaces, specialized plating, and specialized metallization features for ease in assembly, high reliability, and quality control. The substrates are populated with a PZT receiver/transmitter and multiple flip-chip die, which have 22-µm bumps on 70-µm pitch. The end product provides an ultrasound image from within a coronary artery; it is used in vascular and structural heart disease diagnoses and assessments.