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Flexible Assembler Places 21,000cph
February 20, 2007 |Estimated reading time: 1 minute
LOS ANGELES Samsung, with North American distributor Dynatech Technology, is demonstrating the SM321XLB pick-and-place machine at Booth 1801 at IPC Printed Circuits Expo/APEX/Designers Summit, February 2022 in Los Angeles. The flexible system places 21,000 components per hour (cph) at ±50-µm accuracy, and handles thin substrates and large boards.
A next-generation high-resolution flying vision system and board-handling capabilities are added to the SM series with the machine. It processes boards up to 20" × 24", including flexible substrates, and can handle large and small boards in the same production line. Based on IPC 9850 parameters, the pick-and-place system has a 21,000cph speed, while it places BGAs and chip-scale packages (CSPs) at 5,500cph with ±30-µm accuracy. Built-in software optimizes a placement sequence. Optional EasyOLP line-balancing software manages component placement through the feeder system and individual placement machines.
The SM123XLB is configured to be compatible with the Samsung SM series slim-format tape feeder system, which holds up to 120 8-mm feeders.A low-mass head mechanism with high-speed motor is said to create a stable motion platform, and the board transport system reportedly delivers flat handling due to enhancements to the drive system. It is designed to fit into existing or new SMT lines, and handle mixed assembly.