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Board Package Supports Handheld Upgrades
February 12, 2007 |Estimated reading time: Less than a minute
AUSTIN, Texas Freescale Semiconductor released a Windows Mobile 6 board support package (BSP) for OEMs and design firms upgrading products based on earlier iterations. The upgrade targets designs for handhelds such as navigation devices and high-end mobile phones.
The i.MX31 multimedia applications processor platform incorporates BSP in designs requiring low power usage on computationally intensive applications. Designed for the "Professional" package of Windows Mobile 6, the BSP includes the operating system (OS) kernel, OS graphical user interface (GUI), middleware, processor-specific device drivers, and other test suites and applications software. It contains the boot loader, OEM adaptation layer (OAL), drivers for peripherals, build scripts, and other controls. Using the BSP download enables OEMs to design-in messaging, video, Web, voice recognition, and security features of Windows Mobile 6, according to Freescale, without increasing battery power on the design.