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APEX Special Events
December 31, 1969 |Estimated reading time: 3 minutes
Visitors to this year's IPC Printed Circuits Expo/APEX/Designers Summit will join the organization in celebrating its 50th anniversary. Attendees also can preview highlights of the iNEMI roadmap for 2007, participate in free forums, attend various paper presentations, and join others in the industry at the SMT VISION Awards celebration. Following are details of APEX events.
The SMT VISION Awards celebration, Monday, February 19, kicks off at 6 p.m. in the Wilshire Grand Hotel Pacific & Sierra Ballroom, with food and drinks. Awards will recognize winning products in several categories. Dieter Bergman, director of technology transfer, IPC, will speak at the event.
IPC will hold its anniversary reception and dinner February 20, at the show. Denny McGuirk, IPC president, will join various members of the industry as they reminisce about the role of the EMS provider, tradeshows, market research, and other IPC events over the years. IPC has released a commemorative website, www.ipc.org/50th; exhibition, Technology over Time, which will be displayed at the show; and book, From Vacuum Tubes to Nanotubes: An Amazing Half Century. The Emergence of Electronic Circuit Technology 19572007.
International Electronics Manufacturing Initiative's (iNEMI's) industry roadmap for 2007 will not be released until March 5, 2007, but conference attendees can listen to the highlights at a "sneak peak" keynote on February 22. The keynote will review trends, and examine a new chapter in the roadmap: organic and printed electronics technology. The 2007 edition of the roadmap is the most inclusive, globally, of any released by the consortium thus far, according to iNEMI.
Addressing the question of outsourcing assembly, Michael Sivigny, general manager of CeTaQ Americas, will present "Increasing Profitability through Process Optimization," during the technical session "In Source or Out Source: Opposing Factors in Today's Assembly Environment," February 21. The paper examines machine capability analysis (MCA) and equipment performance verification, demonstrating the possible benefits of an optimized automated manufacturing process. Sivigny contends that proper "tuning" of production processes can help companies realize higher profits domestically than through outsourcing to Asia.
Bill Coleman, Ph.D., vice president of technology at Photo Stencil, will present "Lead-free Intrusive Reflow," detailing alternatives to lead-free wave soldering. The presentation will include examples of 63-mil.-thick and 93-mil.-thick PCBs with 6-mil.-thick stencils. The option of intrusive reflow, versus wave soldering, will be discussed by Coleman and George Oxx, of Solectron in N.C., at a poster presentation on the 21st.
Speedline Technologies' authors will present seven papers at APEX, along with industry and academia co-authors. Papers will cover stencil design ("Establishing Stencil Design Parameters for 01005 and 0201 Passives and 0.4-mm CSPs"), flux ("Flux Application for Lead-free Wave Soldering"), small apertures ("Process Development and Characterization of Stencil Printing Process for Small Stencil Apertures"), cleaning technologies ("Hybrid Drying Technology for In-line Aqueous Cleaning of Lead-free Assemblies"), process control ("Reflow Process Control Monitoring and Datalogging"), tin corrosion ("Tin Corrosion and Lead-free Wave Soldering"), and area-ratio rule determinants ("Determining Area-ratio Rule for Type 4 and Type 5 Solder Paste").
Ineke Tiggelen-Aarden, technical director for Cobar Europe BV, will present "Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results," a paper co-authored by Eli Westerlaken, Cobar president. The presentation, part of "New Developments in Solder Paste" technical session on February 21, will outline solder paste characterization, defects, repeatability, and stability in printing and soldering. Tiggelen-Aarden will highlight advances in repeatability with lead-free SAC-based pastes. The paper describes differences between rheometric measuring principles and introduces a sample-preparation method to reduce the impact of thixotropy.
To educate attendees on failure and root-cause analysis, Craig Hillman, CEO and managing partner of DfR Solutions, will give a seminar titled "Understanding Failure and Root-cause Analysis in Lead-free Electronics," on February 18. Hillman will examine failure mechanisms unique to lead-free, and tools and techniques needed to deal with those mechanisms.
JTAG Technologies will host a driving skills game at its booth during the exhibition. JTAG will emphasize the speed of its tools for boundary-scan with the speed-themed game. Daily winners will receive a prize, which JTAG is revealing at the show. The company suggests bringing a pair of racing gloves.