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Next-gen Laser Machining for PCB Designs
February 6, 2007 |Estimated reading time: Less than a minute
OTTAWA Process Photonics (PPI) launched its next generation of laser-machining systems for via drilling, routing, and other processing functions for high-density circuit boards. The FP series suits high-mix, small-lot, and high-volume production. PPI shipped first orders for its FP1000 to a European automotive electronics manufacturer.
The fixtureless, laser-based, materials-processing systems offer high-speed processing with dense designs, which can maximize board functionality. Capable of processing rigid and flex materials and green ceramic tape, the FP series' programmable processes range from via drilling and skiving to cutting and routing. Features include a proprietary active pulse shaping (APS) system, Windows operator interface with automated self-calibration and part alignment, job programming and changeover designed for prototyping applications, and optional automation for materials handling.
The series is designed to integrate with the manufacturing floor, industry-standard files, and data-logging parameters. PPI software allows the machine to transition between prototyping batches and high-volume manufacturing.