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"IPC Midwest" Abstracts Requested
February 2, 2007 |Estimated reading time: Less than a minute
BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries issued a call for participation requesting abstracts and proposals for the inaugural IPC Midwest Conference and Exhibition, September 2528, 2007, in Schaumburg, Ill. Researchers, academics, technical experts, and industry members are encouraged to propose paper presentations or half- or full-day courses by April 18, 2007.
Presentations are sought on electronics manufacturing, including lead-free topics such as tin whiskers and joint reliability; board design issues such as embedded passives and fine pitch; materials, including laminates, high-frequency laminates, and testability; fabrication topics such as plating technology, flex, rigid-flex, and vias; and assembly technology, such as rework-and-repair and no-clean. Half- and full-day courses will focus on design, PCB and electronic manufacturing processes, or materials.
Interested attendees can submit abstracts online at www.IPCMidwestShow.org, or contact Alexandra Curtis at (847) 597-2877.