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Electroplating System Suits Research Prototyping
February 1, 2007 |Estimated reading time: Less than a minute
WILSONVILLE, Ore. LPKF Laser & Electronics developed the MiniContac RS reverse pulse plating (RPP) system for professional production of prototype and small-batch production PCBs. The desktop system is completely enclosed without external connections and performs rapid PCB prototyping, small runs, and research-laboratory production work.
RPP technology reportedly allows uniform metal distribution to improve aspect ratios. The machine can plate holes as small as 0.2-mm vias in 62-mil-thick standard PCBs. Plating is said to be smooth, and thin or fragile materials are supported by an incorporated framework. The menu-driven control system is semiautomated. Circuit boards as large as 230 × 330 mm, double-sided, or multilayer can be used. The process uses safe chemicals in a clean production process, said Jim Greene, VP for North America. It has four replaceable tanks; the company disposes of all plating chemicals for customers.