-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTAI Requests Abstracts
January 30, 2007 |Estimated reading time: 1 minute
ORLANDO, Fla. The SMTA International Technical Committee is considering abstracts for conference papers at SMTAI 2007, October 7 11 in Orlando. Short course descriptions are also welcomed. Deadline for submission is February 16, 2007, with accepted manuscripts due July 23, 2007.
Original, unpublished, and non-commercial papers should describe significant findings in experiments; describe and emphasize new techniques; and contain technical, economic, or relevant test data. SMTAI asks that submitting authors have obtained approval (to write and present the paper) prior to submitting an abstract. The organization will issue awards for best-in-conference, best-in-proceedings, and best-international paper.
The Emerging Technologies Summit (ET) will return to SMTAI, including "hot topics" for 2007. The Lead-free Symposium also returns focusing on case studies and reliability. Those interested may submit a paper on emerging technologies and hot topics alternative energy, China RoHS, embedded passives, or printed electronics, for example. Components-centric papers may encompass BGA and chip-scales packaging (CSP), fine-pitch technology, direct chip attach, 3-D packaging, or other related topics.
In assembly-based papers, SMTAI requests topics such as alternative alloys and lead-free soldering, case studies, and reliability, for example. Lean manufacturing and low-volume/prototype assembly will also be of interest, along with moisture sensitivity, set-up reduction, etc. Papers on high density interconnects (HDIs), microvias, black pad, and embeddeds, and more are requested for the topic PCB technology.
Papers related to process control can focus on automated optical inspection (AOI), in-circuit testing (ICT), software, test strategies, and similar topics. Business papers should examine contract manufacturing, supplier management, technology roadmaps, and relations with Asia.
SMTAI abstracts can be submitted electronically at www.smta.org .