Bonder Assembles Opto-electronic Applications

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TEMPE, Ariz. The OPTO-BONDER FEMTO, in the FINEPLACER product family from FINETECH, performs automated, sub-micron assembly for power laser bonding, flip chip, MEMS and MOEMS, sensors, chip-on-glass (COG), and die-attach assembly.

The system combines ± 0.5 µm accuracy with process flexibility for various assembly applications. It occupies a 1270- × 900-mm footprint and features a 25% larger table than previous generations, X/Y/Z/theta movements, and automatic controls for alignment and bonding processes. The machine handles die up to 4" in diameter and substrates up to 6" with automatic pattern recognition. It suits production and process- or product-development environments.



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