High Currents and High Temps. Impact SMT/HYBRID/PACKAGING

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STUTTGART, Germany SMT/HYBRID/PACKAGING 2007, April 24-26 in Nuremberg, Germany, will address high-current circuit boards and thermal management as central topics of the conference.

DaimlerChrysler will give an introduction to this theme, followed by 13 presenters exploring different concepts of thermal transfer, the architecture of high-current boards, electromigration, high-temperature soldering materials, and other related topics. Professor Wolfgang Scheel, Ph.D., of the Fraunhofer Institute for Reliability and Microintegration; and Annemarie Biener, FUBA PRINTED CIRCUITS GmbH, will chair.

Covering design, process technology, and other aspects of electronic-assembly production, 27 half-day tutorials nine in English will run on the 24th and 26th. The show will also highlight flex circuits in an assembly demonstration on the exhibition floor.



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