Paste Automates Image Sensor Assembly


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IRVINE, Calif. A non-conductive paste (NCP) underfill and encapsulant, Hysol FP5110, from Henkel, adheres flip-chip image sensor modules to two- and three-layer flexible printed circuits. The paste bonds to polyimide and epoxy adhesive materials.

By bonding bumps onto the substrate with lead-free-compatible thermal compression, the paste reportedly eliminates flux application, reflow, and cleaning. The product can be dispensed automatically, uses a 10-second cure at 180°C, and can be stored at -15°C. Henkel will market the paste as a substitute to manual anisotropic conductive film (ACF), targeting image sensor applications, particularly in mobile phones.

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