-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTAI Call for Papers
December 6, 2006 |Estimated reading time: 1 minute
MINNEAPOLIS SMTA International, October 7 11, 2007, in Orlando, Fla., is soliciting abstracts for technical papers, as well as potential course descriptions.
Abstracts should be submitted to the SMTAI Technical Committee by February 16, 2007, with manuscripts due in July. The SMTA will accept online submissions on its Website. Original, unpublished, and non-commercial papers submitted for the conference should describe significant results from experiments; emphasize new techniques; and contain technical, economic, or appropriate test data. SMTAI offers several awards for best papers domestic and international.
The SMTA will focus on technologies using new materials and processes, or serving consumer applications; packaging advancements such as system-in-package (SiP), package-on-package (PoP), MEMS/RF/MOEMS, chip-scale and wafer-level packages, and optoelectronics; wireless devices such as Bluetooth and Wi-Fi; and the little things nanotechnology and 0201/02005 components. Other topics of interest include assembly advances, development and use of getters, battery interactions, solderability and reliability, embedded passives, failure analysis, attachment technology for fine-pitch and flip-chip applications, prototyping, and harsh operating environments. Papers related to lead, lead-free, alternative alloys, and surface finishes also are of interest, as are PCB technology, process control, and business issues. A full list of suggested topics can be found at the above link.
Abstract submissions must be approved prior to submission. SMTAI expects submissions have received appropriate approval.
In addition to courses and technical presentations, SMTAI will host Technology Showcase 2007, an exhibition for product demonstrations.