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Cookson Restructures
December 4, 2006 |Estimated reading time: Less than a minute
JERSEY CITY, N.J. Cookson Electronics Assembly Materials (CEAM) will reorganize its manufacturing operations in the North America region, incorporating a new manufacturing plant and shifting some production offshore. Implementation will occur over the next 6 12 months.
Citing change to the North American marketplace, CEAM announced strategic moves for efficiency and growth. CEAM will transfer ALPHA solder paste, cored wire, and wave-soldering flux product manufacturing to two sites in Mexico; it will close two sites in the U.S. CEAM's corporate headquarters, including its U.S.-based R&D functions, will move to a new location in New Jersey.
Cookson Electronics views the partial shift to Mexico and concurrent strategic restructuring as factors that will allow it to support competitiveness in the region. The change will generate resources for R&D efforts, according to Rick Ertmann, executive vice president of the Americas region.