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SWEPEX, SMTA Co-locate for Technical Talks
November 13, 2006 |Estimated reading time: Less than a minute
PLANO, Texas The SMTA Dallas Chapter will co-locate technical presentations with the Southwest Electronics Production Exposition (SWEPEX), November 14 and 15, 2006 in Plano, Texas.
Presenters will cover topics from RoHS to China in case studies, paper presentations, and luncheon keynotes. Lead-free manufacturing matters include compliance testing, studied by Glenn Robertson; thermal properties of lead-free solder with nanoparticle reinforcement, a technical presentation by Dechao Lin; the Chinese RoHS initiative, scrutinized by speaker Harvey Stone; stencil design, explained by Chris Shea; tin whisker mitigation, presented by Joe Smetana, and several other topics. Peter Biocca of Kester will present solutions to increase yields by decreasing voids in lead-free assembly.
In other SMT-related papers and presentations, lean sigma, scheduling, and quality assurance aspects of assembly will be investigated. On the 15th, Gail Flower, editor-in-chief of SMT and Advanced Packaging Magazines, will examine the dynamics of the industry in a luncheon keynote.
Tutorials on lead-free, acquisition management, trouble-shooting and other topics will take place at SWEPEX, in addition to the presentations. In total, the exposition will host 10 technical papers and 12 seminars, as well as live demonstrations from suppliers and vendors on the exhibit floor. To learn more visit swepex.org.