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SANTA CLARA, Calif. Agilent Technologies will license Medalist bead-probe technology, a methodology for placing solder beads directly onto PCB signal traces, to Medalist 3070 and i5000 in-circuit test (ICT) customers, as well as to vendors of other ICT equipment.
Addressing test accessibility on dense or high-speed PCBs, the technology allows manufacturers to place bead probes, or solder beads, directly onto traces after completing circuit layout. The process, implemented with typical SMT manufacturing steps, reportedly enables test access without the need for re-routing and without circuit-performance degradation. Agilent notes that designs with high-speed buses limit areas on the layout to place test targets. The right-to-use license includes "Bead Probe Handbook: Successfully Implementing Agilent Medalist Bead Probes in Practice."