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SAN DIEGO A family of self-filleting die attach adhesives, AAA3300 from Advanced Applied Adhesives (AAA), offers properties comparable to die-attach film, in a paste. The self-filleting die attach adhesive is said to enable thin-die assembly at improved yields with conventional assembly techniques.
The series exhibits capillary flow to 100% die coverage in specified temperature ramp-up. AAA states that the paste will not produce a bulky fillet, which could overflow to the top of a thin die before cure onset; the paste wets well with BGA substrates and die tops.
With low modulus and high adhesion to substrates, the AAA3300 and AAA3310 suit BGA and alloy 42 applications assembly situations with concerns about substrate warpage. The material flows to cover the die during standard ramp-cure-profile times, and optional spaces offer bondline control. The AAA3320 suits same-die-stacking when low thermal coefficients (CTEs) are needed to reduce encapsulated-wirebond fatigue and failure.