Zuken, Rio Partner on Chip to PCB Design


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MUNICH, Germany; WESTFORD, Mass.; and YOKOHAMA, Japan Zuken and Rio Design Automation, with some collaboration from Magma Design Automation, will work in a cooperative sales and technical development program to generate an optimized design environment from chip to package to PCB.

Zuken will acquire exclusive distribution rights to Rio's products in Japan, Korea, China, Taiwan, and other Asian countries (excluding India) and will offer support services. As part of a pre-existing OEM distribution agreement, Rio and Magma will provide an integrated chip/package co-optimization flow. By adding Zuken, the collaboration will also incorporate board design. Zuken optimizes electrical and electronic engineering designs and related manufacturing processes through electronic design automation and computer-aided engineering solutions.

Using Zuken's distribution networks, Rio, a developer of design tools for package and semiconductor design integration, will release RioMagic FC for flip chips, WB for wire bonds, and SIP for system-in-package. A CR-5000 PCB and advanced packaging layout suite will interface with these Rio products for full integration of design processes. The companies expect the collaboration to result in a choice of layout tools from EDA vendors, and facilitated exchange of packaging information for chip to PCB design. The program targets mobile equipment designers and consumer product manufacturers.

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