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Future Directions in Packaging at SMTAI
September 27, 2006 |Estimated reading time: 5 minutes
CHICAGO SMT's panel at SMTAI focused on the possibilities and trends opening up in the packaging realm, and the relevant surface mount technologies that accompany them. Presenters ranged from government laboratory scientists to consultants and technology experts. SMT editor-in-chief Gail Flower moderated the panel, with managing editor Michelle Boisvert to co-chair. Flower prefaced each presentation with an introduction to the presenter's themes, along with a brief biographical introduction of the speaker. The main point that could not be emphasized enough was the effect of 3-D packaging on the industry. From proper X-ray inspection to applications in deep space, presentations educated the audience on what 3-D packaging means for practical and future applications.
The panel began with Richard Boulanger of Boulanger Consultants, who explored trends in 3-D package assembly. He asked whether we should treat 3-D packages as small PCBs or large modules, and what the proper method of assembly entails. Boulanger also defined the differences between EMS providers and SATS in package assembly. Boulanger asserted that a marketing shift is occurring from 1st level SATS manufacturing to 2nd level EMS providers. He warned that choosing one over the other was not a black-and-white decision SATS are smaller but more capable in terms of complex operations, and EMS providers are global but usually require a more expensive tape-and-reel delivery system for packages. Boulanger also delved into the challenges with package-on-package (PoP) assembly. Generally, according to Boulanger, assembly of PoP devices is done at the board level, which means that vision capability and accuracy in placing packages must be heightened. He noted that some large OEMs are production-capable today. Contact Boulanger with questions or comments by e-mail.
Reza Ghaffarian, Ph.D., presented next. With a focus on space applications, the NASA expert looked at the molecular electronics involved in using the third dimension of a package. Ghaffarian identified the emerging importance of "more than Moore (MtM)." He also saw carbon nanotubes and nanowires as near-future applications, while quantum electronics are still farther off. Ghaffarian treated the audience to a few photos of the Rover vehicles headed for Mars, and explained the various package stacking technologies that went into the machines. The "space cube" involves stacking modular packages, so any changes may be made without destroying the component. To learn more about surface mount technology traveling to Mars and other outer space locations, contact Ghaffarian by e-mail.
Ken Gilleo concluded the first half of SMT's panel with a look at the polymer technology going into 3-D packages. Gilleo's "Tech Thermometer" graphic placed importance on packaging trends in densification, and other areas. He noted, "packaging is just materials and geometry," explaining the complexity of such a simple concept. Gilleo added that the possibilities inherent in MEMS make the functionality of a package more interesting than in the past. During his presentation, Gilleo touched on the interesting Z-space realm, injection-molded plastics, and the various methods of densification. He may be reached for comment by e-mail as well.
Paul T. Vianco gave the group an in-depth look at the possibilities, capabilities, and importance of ceramic wiring board technology. Vianco shared his insights on ceramic materials trends, and why these materials are moving beyond high-cost, high-value applications and crossing over to the consumer market. He examined the process of densification that results in these fine-pitch substrates for RF components and other packages. Though ceramics still have issues with fragility and weight, Vianco spoke about the higher layer counts in thinner ceramic boards. He introduced many studies being undertaken on the interfacial interactions between solder, thick film, adhesive glass, and ceramic layers that compose populated ceramic boards. Interest in the nature of firing temperatures, porosity, and solid state materials interactions were explored. To contact Vianco with questions regarding ceramic substrates, please e-mail him.
SMT's fifth panel member was Lee Smith, whose "CMOS Evolution vs. Package Revolution" comparison chronicled packaging and fab dynamics from 1985 onward. Another trend Smith identified was the emerging importance of OSATs in manufacturing, especially consumer electronics. Smith educated the audience on the economic theory of Moore's Law in relation to market-share forecasts in packaging sectors. From the 1970's to 2004, the vast changes in package size, and cost, reveals trends that revolutionized packaging. In contrast, the relationship between node size and cost in fabs was consistent and predictable as processes moved to 90 and again to 65 nm, and so on, costs rose. Smith sees fragmented supply chains and outdated business models as a major challenge for global manufacturing, and added that OSATs will take about 50% of manufacturing by 2010. Please contact Smith with questions and comments via e-mail.
The series of outlooks on 3-D packaging continued with Dave Bernard's tutorial on effective inspection techniques for dense 3-D packages. To improve capabilities, inspection machines use enhanced gray-scale imaging, and are nondestructive. After summarized the implications of current packaging trends for the X-ray inspection sector, Bernard outlined appropriate situations for different X-ray inspection techniques. Bernard noted that seeing all levels of a stacked package at once can be confusing, and illustrated ways to "slice" package images for clarified analysis. Bernard explained that no blanket 2- or 3-D inspection approach will yield the same benefits as a well-planned combination of the two. He may be reached via e-mail.
The final presenter on SMT's "Future Directions in Packaging" panel was Chuck Bauer. He explained the business side of system-in-package (SiP), with a brief look at "sideways" modular, "origami" folded, and other stacked packages. Bauer ran through several cost analysis situations for creating a wireless device from flip chips to BGAs and 3-D SiPs. He found that the cost factor is just as important at the system level as it is at the package level, and that, sometimes, the most expensive assembly solution can be tweaked slightly to become the least expensive. Bauer added that moving from a high-density PCB to a standard board with a SiP generates significant costs-savings. Bauer can be reached by e-mail as well.
SMT tested the audience's knowledge with a brief quiz on the technologies and trends examined by each panelist, and everyone received prizes for participating, from SMT and the companies that panelists represented. Flower then presented the panelists with certificates of thanks for their efforts and participation. SMT will make copies of the presentations available; those who wish to learn more can send an e-mail to Meredith Courtemanche, assistant editor.