SMT/HYBRID/PACKAGING Calls for Tutorials

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NUREMBURG, Germany SMT/HYBRID/PACKAGING 2007, an exhibition and conference on system integration in microelectronics, is accepting applications for tutorial presentations in several packaging and assembly fields.

Tutorials on assembly include electronic assembly design, assembly of electronic components, interconnect technologies, process technologies, diagnostics and quality assurance, and technical reliability. Tutorials may also be presented on vertical system integration on PCBs.

Other subject matter under consideration includes packaging of electronic components and PCB interfaces, advanced materials, and sustainability. Topics beyond these suggestions will also be considered. The tutorial submission deadline is October 13, 2006. Tutorials can be held in English or German by one or more speakers chosen by the tutorial organizer. The timeframe is limited to three hours and commercial presentations will not be accepted. For more information go to the online form. The conference will take place April 24 26, 2007, in Nuremberg, Germany.



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