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Synova Opens 2nd U.S. Micromachining Center
September 18, 2006 |Estimated reading time: 1 minute
LAUSANNE, Switzerland Synova will open its second U.S.-based micromachining center (MMC) in Boston, Mass., for high-precision electronics manufacturing. Set to open in January 2007, the center will operate in tandem with a West Coast site, under construction in Silicon Valley. Synova will use the facility as a competence center for demonstrations, sample tests, and application development.
The company has more than 50 machines in operating facilities, 12 of which are in the U.S. The Boston MMC will feature an LCS 300 a water-jet-guided laser cutter, which cuts, drills, and creates grooves in metal masks to manufacture PCB stencils, wafer bumps, and other screens. Customer interest in the Boston-area will be concentrated on the Laser MicroJet product for high-power LED wafer dicing, and other semiconductor applications, according to the company.
Synova received financing for $8.1 million, or 10 million Swiss francs (CHF), from Swiss banks to develop the MMCs in several international locations. Synova operates an MMC at its headquarters in Switzerland, and at smaller location in Taiwan. The first to open as part of the funding program will commence operations in January 2007. "We will invest the majority of the funding into these structures in the U.S., Japan, and Korea in the first year. For 2008, we plan to develop in China, Singapore, and Germany," said Bernold Richerzhagen, president and CEO of Synova. In the first year, the company will hire 6 8 staff members.
In addition to building more support centers, Synova will also pursue relevant ventures in industries and application areas beyond semiconductor manufacturing, such as precision-centric sectors (inkjet print-head MEMS, hard disk drives, and organic light-emitting diodes [OLEDs]), and tooling, solar energy, automotive, and medical areas. Circuit board marks, solder masks, and other PCB applications are also developing.