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BANNOCKBURN, Ill. IPC?Association Connecting Electronics Industries, and the China Printed Circuits Association (CPCA) co-announced the third annual Global Board Technology Symposium, "Working Together to Advance Industry Capability," October 13 14, 2006, in Shenzhen, China. The symposium, open to PCB fabricators, assemblers or EMS providers, equipment and material suppliers, OEMs, and original design manufacturers (ODMs), will focus on the desktop, mobile, handheld, server, and wireless end-markets.
Representatives IPC's OEM Workgroup Committee, including Intel, IBM, HP, Dell, and TI, will present on future needs for PCB development and expanded assembly and test manufacturing. The intent is to share industry survey and test vehicle results, helping to align and advance PCB fabrication industry capabilities with OEM and ODM future product technology requirements. The symposium will provide an open forum to stimulate discussion of trends, process and material challenges, and product roadmaps based on industry drivers and fabrication capabilities.
Approved by the Administration of Civil Affairs Department of China, the CPCA is the national grade-one printed circuit trade organization, under the direction of the Ministry of Information Industry Department. Its 600 members are PCB producers, CCL and special material suppliers, special equipment manufacturers, SMT and EMS manufacturers, research institutes and universities/colleges.
To learn more about the event, contact David Bergman with IPC.