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ATExpo Product Review
December 31, 1969 |Estimated reading time: 9 minutes
Following are a variety of products from a few companies exhibiting at the Assembly Technology Expo (ATExpo), September 26-28, 2006. Be sure to visit each company for complete product information.
Metrology System
The VIEW Benchmark 450 non-contact metrology system provides digital megapixel cameras, continuous image capture, computer-aided design (CAD)-driven software, and a dual-camera optical system. It suits high-throughput electronic assembly process qualification. Pixel arrays enlarge field-of-view (FOV), while greater pixel density is said to maintain higher resolutions. Continuous image capture is said to improve throughput by capturing multiple images as the part moves beneath the system optics. Its 450- × 450-mm stage supports large footprint parts or nested groups of smaller parts. VIEW Engineering, Inc., Simi Valley, Calif. Booth #5308.
Stencil Cleaner
The water-soluble 440-R SMT Detergent enables manual stencil and tool cleaning. The cleaner is said to improve print production without noxious odors or hazards of heavy metal contact associated often with solvents. The product chemistry is verified by the EPA for environmental and user safety. Smart Sonic Corporation, Canoga Park, Calif. Booth #6027.
Solder Pot Retrofit Kits
Solid titanium retrofit kits are said to reduce costs of conversion, resist contamination, and prolong service life. The kits offer a range of components, including nozzles, chimneys, impellers, shafts, and solder pots. The company also offers in-the-field retrofitting services. NEA, Londonderry, N.H. Booth #5602.
Low-voiding Solder Paste
The 5.1AT lead-free solder paste features voiding in the 5% range when soldering BGAs with micro-via-in-pad designs. The paste offers beneficial response-to-pause, effective wetting to lead-free metallizations, and a wide reflow process window. Indium Corporation, Clinton, N.Y. Booth #5231.
LeadHound II
The LeadHound II features a RoHS/WEEE pass-fail mode that tests both plastics and metals. The product uses X-ray flouresense (XRF) technology to detect the presence of restricted elements, providing a percentage of each element found. The machine follows IEC screening guidelines, or user-defined parameters, to determine compliance of soldering materials or components. Compliance with RoHS, military, and other regulations can be tested. Hepco, Sunnyvale, Calif. Booth #5140.
AOI System
The Medalist SJ50 Series 3 is a flexible, high-speed inline or off-line automated optical inspection (AOI) system that can be used throughout multiple locations on the SMT line. The system provides pre- and post-reflow solder joint inspection and post-paste, 2-D solder paste inspection. The SJ50 can also inspect 01005s. Other features include 3-D Solid Shape Modeling (SSM) for high-call accuracy, universal part programming, self-learning algorithms, and two algorithm engines for geometric pattern matching. Using an optional conversion kit, the system adapts to the SP50 Series II for 3-D solder paste inspection. Agilent Technologies, Palo Alto, Calif. Booth #5821.
IT Feeder
The SM320 IT feeder was designed to achieve placement rates up to 18,500 components per hour (cph), with 50-µm accuracy and up to 5,500 cph at 30 µm for QFPs and BGAs. The feeder’s frame and gantry system feature a twin-servo motor designed to provide stability at higher speeds. The machine joins SM series intelligent feeders (SM-IT), and includes one-touch clamping, add-on-reel inventory, lot tracking, and automatic feeder recognition with off-line programming. It processes components ranging from 01005s to 55 mm2. Samsung/Dynatech, Horsham, Pa. Booth #5000.
Device Programmer
The desktop FLX500 enables automated device programming and features a plug-and-play modular design, CAN-Bus control architecture, self-contained air supply, automatic tray scanning, and a local coordinate system for placement accuracy. The universal power supply and self-contained pneumatic system enable easy installation. The programmer supports memory and microcontroller device technologies using FlashCORE programming, suits low- to medium-volume, high-mix programming applications, and allows users to pre-configure multiple jobs. Data I/O, Redmond, Wash. Booth #5700.
Pick-and-Place
Based on the SIPLACE platform, the SIPLACE D-Series features a digital vision system and software. It meets the requirements of standard- and high-performance applications, and is available with one to four gantries. Each gantry suits standard applications and complements X-Series machines. D-Series machines can be configured and combined, and have a linear direct drive on the Y-axis. The platform incorporates collect-and-place heads, flexible dual transport, and digital head-mounted and circuit board cameras. Siemens Electronics Assembly Systems, Atlanta, Ga. Booth #5030.
Lead-free Solder Paste
The LF-4300 RoHS-compliant lead-free solder paste is water-washable and works in no-clean applications. The solder is compatible with lead-free, tin/lead, and high-temperature alloys. When used as a no-clean, flux residue remains clear and meets SIR requirements. The LF-4300 contains less than 200 ppm of lead, and facilitates lot-to-lot consistency and 12-hour stencil life. Features include no mid-chip beading, pin probability for ICT, and compatibility with AOI systems. The paste works in convection and vapor phase processes, and is compatible with all board finishes. AMTECH, Branford, Conn. Booth #5921.
Tabletop Robot
The TT Tabletop Robot features a rigid base of aluminum-extruded material, accurate ball screw, built-in X-SEL controller, and servo-control motor. It supplies a positioning repeatability of ±0.02 mm and eliminates mis-stepping. The gate-type robot includes a fixed Y-axis for unbalanced loads, heavy Z-axis loads, and loads that overhang the slider. The cantilever-type robot provides a wide, open work surface for large or irregular loads in a fixed condition. Two actuator operating ranges are available. IAI America, Itasca, Ill. Booth #823.
Rework Station
The Summit 2200 rework station combines past-generation components and processes with updates such as an automated site-prep (scavenging) system for automatic component removal, non-contact site prep, and component placement. The automatic- and vision-assisted placement enables precision placement of high-lead-count components. A 4.0- to 5.6-kW bottom heater and motorized table assist in lead-free processes. VJ Electronix, Inc., Littleton, Mass. Booth #5840.
No-clean Solder Paste
NC254 is a halide-free, lead-free-compatible, no-clean solder paste featuring a board process window for accurate testing. The product features low post-process residues on SMT applications. The residues are pin-testable with various probe styles and materials. They will not shatter during testing, or damage or inhibit probe heads. The solder paste also reportedly produces shiny solder joints, enhances wetting, and is compatible with common lead-free solder alloys. AIM, Cranston, R.I. Booth #5318.
Table Robot
The TR300 table robot for automatic selective and point-to-point soldering is designed for small batches and low-volume production. The table robot offers PC-programmable functions in a Windows environment. Each automated soldering process can be controlled with custom parameters on a bench-top system. Global Automation, Old Saybrook, Conn. Booth #5414.
Lead-free Solder Paste
The ALPHA OM-338 PT lead-free, no-clean solder paste is said to improve pin testability, print speeds, throughput, and yield. It was developed for EMS and OEM customers using inline testing to reduce the number of false negatives recorded with pin probes. The solder paste leaves no residue on pins, and prints up to 150 mm/sec. on 12-mil. squares and 10-mil. circles. Cookson Electronics, Jersey City, N.J. Booth #5732.
Thermal Process Monitor
The 24/7 Process monitor gives an operator automatic profiling of every product, constant monitoring, statistical process control (SPC) charting, analysis, documentation, and production traceability throughout the thermal process. Tracking occurs without production interference. It charts peak temperature, soak time, time above liquidus (TAL), and other process specifications, and plots them with calculations. Overall process window index (PWI) is also charted. Process drift outside of defined control limits triggers an alarm. KIC, San Diego, Calif. Booth #5207.
Nitrogen Generation System
The Balston MB Series Monobed nitrogen generators produce up to 99.99% pure compressed air at -70°F (-21°C) dew point. The generators are designed to transform standard compressed air into nitrogen continually at regulated pressures - without operator attention. Nitrogen is produced through a combination of filtration- and pressure-swing absorption technologies. A pre-filtration system pre-treats the compressed air, removing contaminants. The generator includes an oxygen analyzer to monitor concentration. Parker Hannifin Corporation, Filtration and Separation Division, Haverhill, Mass., Booth #1453.
Screen Printing Platform
The Horizon 01i screen printing platform for HM/LV handles 0201 and CSPs. Equipped with the Instinctiv user interface, the ISCAN control area network supports advanced features and displays maximum mechanical and thermal stability. The platform delivers a 10-sec. cycle time, process capability of 2.0 Cpk at 25 µm, and includes a post-print verification system. DEK USA, Flemington, N.J. Booth #5400.
Portable RoHS Analyzer
The NITON XLt 797X portable analyzer features small-spot focus capability, proprietary X-ray tube technology, and an internal color video camera. The product identifies, analyzes, and records test results for small components. The analyzer can be used to screen polymers, solders, and components for RoHS compliance. The small-spot focus feature supports solder joint and miniature component analysis on populated PCBs and heterogeneous materials. The CCD camera locates, specifies, and saves an image and its chemical analysis. Thermo Electron Corporation, Billerica, Mass. Booth #5729.
Solder Surfactant
The MS2 molten solder surfactant removes dross formed when solder is bound in oxides during tin/lead and lead-free alloy soldering processes. When applied to molten solder, the liquid gathers metal oxides and releases unusable metal into the solder pot. The process is said to improve wetting and reduce the volume of hazardous waste. P.Kay Metal, Inc., Los Angeles, Calif. Booth #5922.
CSP/BGA Underfill
Loctite 3549, a high-flow underfill was designed to fill the space beneath CSPs and BGAs and cure rapidly at low temperatures - minimizing thermal stress to other components. When fully cured, the product protects solder joints from shock, drop, and vibration. Loctite 3549 is lead-free compatible and reworkable with a long pot life. The electronics group of Henkel, Irvine, Calif. Booth #5026
Assembly Robots
A range of compact 4-, 5- and, 6-axis robots target payloads up to 20 kg, with reaches from 350-1,300 mm. The robots offer repeatability within 0.015 mm. Standard and clean-room models are available. Other features include programming software, controllers, and teaching pendants. DENSO Robotics, Long Beach, Calif. Booth #311.
Wave Solder Machine
The SM-450 wave solder machine offers lead-free soldering with a computer-controlled spray-fluxing unit, conveyor width, and angle adjustments. The SM-450 features three preheat zones with independent temperature and airflow controls. A consistent wave surface, lack of moving mechanical parts, and dross-reducing design are said to aid in solder reliability. Other features include forced cooling, optional nitrogen, and electromagnetic pump systems. This system is the result of a partnership between Qualitek and JT Electronics. Qualitek International, Addison, Ill. Booth #5719
X-ray Platform
The COUGAR-VXP: SMT Version X-ray platform addresses inspection requirements for SMT assemblies, such as BGA and wafer-level CSPs. It includes a FEINFOCUS graphical user interface (GUI), a microfocus X-ray tube up to 160Kv, 5-axes manipulator with auto-isocentric-motion technology for oblique viewing, and CNC capabilities. The X-ray also features real-time, 16-bit image processing; a hardware-driven anti-collision system; feature-recognition down to 1 μm; and total magnification up to 6,000×. COMET North America, Inc., Stamford, Conn. Booth #1801.
3-D X-ray
A computerized tomography (CT) option for the XiDAT XD7600NT X-ray system is said to refine imaging with volumetric reconstruction of solder joints. The imaging program generates digital geometric models from a series of individual 2-D image slices, which are captured while the sample is rotated in the X-ray beam. They are then reconstructed on a server as a 3-D image. This option is suitable for analytical analysis of interconnections for stacked die, MEMS, package-in-package (PiP), and package-on-package (PoP). 3-D models offer image manipulation, cropping, volume rendering, and cross-section capabilities. Dage Precision Industries, Fremont, Calif. Booth #5606