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NASHUA, N.H. The mantra of faster, smaller, cheaper has never been so relevant as in today's advanced packaging area. University professors, OEMs, and contract assemblers (EMS providers) will discuss methods used for increasing densities (stacking, building more into a chip-scale package, mega-package with many technologies) in a lively and informative panel hosted by SMT Magazine at SMTAI. Of interest will be the use of SMT-style assembly in the packaging industry. The interactive panel, "Future Directions in Packaging," held on Tuesday, September 26th from 10 11:30 a.m., will conclude with questions from the audience, questions for the audience, and copies of the presentations.
Lee Smith of Amkor will examine design challenges across a fragmented supply chain, as well as the impact of package roadmaps on PCBs and the SMT process. Smith is recognized as an authority on stacked packages, and has worked for more than 25 years in the electronic application and assembly technology fields. Areas of interest for Smith include flex-circuit-based folded assemblies, package-on-package (PoP), and 3-D packaging. Smith will also touch on the overlap of OSATs and EMS providers in the outsourcing market.
Paul Vianco, Ph.D., a principal member of the technical staff at Sandia National Laboratories, will present on substrate materials for denser components, including screen-printed thick-film-layer conductors, gold-filled vias, and low-temperature co-fired ceramics (LTCC) in his explanation of useful materials. Processing concerns, such as lead-free, will be addressed in relation to ceramic printed wiring assemblies (PWAs). Vianco researches soldering technology for thermal mechanical fatigue tests and solid-state intermetallic compound-layer growth. He received his Ph.D. in materials science from the University of Rochester, New York.
Reza Ghaffarian, Ph.D., recipient of NASA's Exceptional Service Medal, will present on packaging solutions being used for deep space applications. He will highlight the third dimension of a package stacked packages, system-in-package (SiP), system-on-package (SoP), and 3-D packaging in relation to molecular electronics for space, including expeditions to Mars. Ghaffarian, who leads R&D efforts in SMT, BGA, CSP, and MEMS/MOEMS technologies for NASA missions at the Jet Propulsion Laboratory, will highlight the current, near-future, and future capabilities of these technologies.
Ken Gilleo, Ph.D., will examine revolutions in polymers. His presentation on the future in plastics inspired by a famous line from the movie The Graduate will cover design freedom, manufacturing versatility, and engineering properties of polymers used for 3-D vertical packages and wafer-level packages (WLPs). Gilleo argues that MEMS and nanoelectronics will tap into the complex and precise mass-produced structures available with polymer injection-molding technology. He also plans to highlight plastic packaging milestones from 1948 to present, as well as projected milestones of 2048.
David Bernard, product manager of X-ray systems with Dage Precision Industries, will speak on popcorning in BGA devices. Bernard will explain how moisture sensitivity levels (MSLs) of devices can increase one to three levels when using lead-free materials. Device popcorning becomes more likely in situations where MSLs are high. When popcorned BGAs do not produce solder bridges, solder ball diameter measurements might help identify the fault. Bernard will summarize his approach to measurement and the usefulness of this procedure.
Other presenters will include Chuck Bauer, senior managing director of TechLead Corporation; Ron Lasky, Ph.D., PE, SMT editorial advisory board member; and Richard Boulanger, former vice president of the Advanced Semiconductor Assembly division at Universal Instruments. Bauer has experience with PCB and hybrid fabrication, complex IC metallization, multilayer packaging, multichip modules, and flat panel display packaging and assembly. Lasky, senior technologist at Indium Corp., also fulfills duties as visiting professor at Dartmouth College. Boulanger will present on stacked packages with an assembly perspective.
Join us at this energetic panel to learn, discuss, and win some prizes!