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Cookson Technology Group Solves Assembly Issues
August 11, 2006 |Estimated reading time: Less than a minute
JERSEY CITY, N.J. Cookson Electronics Assembly Materials announced it has established a global applications technology and engineering group, which joins its global R&D group. This effort formally integrates the company's field engineer network knowledge base into its internal applications structure. The global technology group will help Cookson's customers in solving assembly technology, yield, and reliability problems using the company's process dynamics, internal testing, and validation capabilities.
Companies find practical challenges in assembly processes as lead-free production becomes a daily reality, said Steve Brown, director of global applications technology, Cookson. The group will collaborate with field applications engineers and use two fully-automated SMT and wave soldering lines, with automatic solder paste inspection, to recreate and analyze problems. This capability within the Cookson Electronics labs will be available for Cookson test vehicles or customer-specific PCBs.