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FRENCHTOWN, N.J. To resolve BGA soldering issues common when lead-free solder balls reflow on a board with tin/lead BGAs Aries Electronics produced a BGA-to-BGA adapter. The ARI-A-7277 eliminates incomplete wetting at tin/lead reflow temperatures, through use of a glass-reinforced material and two reflow operations that compensate for temperature discrepancies.
Lead-free BGAs can be mounted to the reinforced material at high temperatures. Once a lead-free component is solder-attached, the adapter, which has eutectic tin/lead balls as terminators, can be reflowed to the board at lower temperatures. The adapter's finish comprises 3 8 µin. of gold over nickel (ENIG) with red solder mask.