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Mild Cleaner Extends Contact Times
August 9, 2006 |Estimated reading time: Less than a minute
ASHBURN, Va. ZESTRON America introduced the VIGON A 200+, an updated VIGON product based on the company's MPC technology. The cleaning agent specifically developed for low- and medium-pressure spray-in-air processes allows for long exposure times without detrimental effects on materials or solder joints. The mild formula supports batch-cleaning applications.Compared to more volatile agents, the aqueous-based cleaning agent is said to increase bath loading capacity and extend bath life. The formula can also generate shiny solder joints and low ionic contamination. A surfactant-free formula eliminates white residue formation on cleaned parts and equipment. The updated product removes a wide range of flux residues, has no flash point, and will not foam under high pressure.
VIGON A 200+ conforms to RoHS and WEEE guidelines, as well as other environmental and safety requirements.