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SAN DIEGO The PARMI SPI HS30 3-D inline paste inspection system from Eunil H.A. Americas inspects several types of solder paste defects after screen printing by measuring height, area, and volume. Its 3-D data is said to back-up system performance for reliability and accuracy.
The PARMI SPI HS30 3-D system can detect printing faults, such as volume, height, area, registration, and bridging to monitor the printing process. Using statistical process control (SPC), the system offers both on- and off-line print-process monitoring and control. The HS30 prevents faulty PCBs from continuing to the next process increasing first-pass yield and reportedly reduces rework.