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Endicott Picks Accela for Packaging Advancements
August 3, 2006 |Estimated reading time: Less than a minute
FRANKLIN, Mass. and ENDICOTT, N.Y. Endicott Interconnect (EI) Technologies has selected Speedline Technologies' MPM Accela printer for its SMT and semiconductor back-end assembly processes.
The companies are currently beta testing on several advanced hardware and software options for the Accela, which are expected to use the system's patented texture-based inspection algorithms to develop higher-resolution 2-D inspection capabilities. This development will enable ultra-fine-feature 2-D capabilities required for higher-density assemblies using smaller- or finer-pitch components. "The sophisticated Accela printer provides a strong foundation as we jointly work to extend its capability... to offer advanced packaging solutions to our customers," said Don Webster, EI process engineer.
EI also plans to use Speedline's Accela printers to process substrates in flat carriers, and perform fine-feature assembly inspection at their N.Y. facility. The Accela stencil printer, a winner of an SMT VISION Award, features parallel processing and design that is said to reduce the causes of downtime. The printer uses seven patented and five patent-pending technologies. Endicott Interconnect Technologies is a supplier of electronic interconnects solutions such as fabrication and assembly of complex PCBs, flip-chip and wire-bond semiconductor packaging, and precision equipment manufacturing and integration.