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Material Set Launched for Ultra-thin SMDs
July 26, 2006 |Estimated reading time: Less than a minute
DUSSELDORF, Germany The electronics group of Henkel launched the Hysol QMI529LS and GR828A, a multi-level material set that includes die attach and mold compounds for thin and ultra-thin surface mount device (SMD) applications.
Henkel designed the kit to deliver thin and reliable material properties for low-profile packages. The die attach adhesive is suitable for TSOP, TSSOP, and TQFP packages, claims Henkel. The mold compound and die attach are also lead-free and can withstand lead-free reflow processing temperatures.
The QMI529LS die attach material features hydrophobic properties and stability at high temperatures, while the mold compound is said to exhibit low-stress and improved gate-leakage performance qualities. The materials were tested to JEDEC Level 1, 260°C.