Ning-Cheng Lee Joins CPMT Board of Governors


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CLINTON, N.Y. The IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society appointed Ning-Cheng Lee, Ph.D., vice president of technology at Indium, to their Board of Governors. CPMT members elect 18 at-large Board of Governors, six per year, for three-year terms. They meet three times a year for society policy formulation, expenditure votes, and general forum activities. Members are generally "people who are known as leaders in their technical field, and are interested in taking an active role in leadership," said Marsha Tickman, executive director, CMPT society. She added that members nominated Lee to run for election.

Professionals in technical fields may become senior, regular, associate, or affiliate members of the CMPT society. "Though the main concern of the board is policy, individual members take focused activities. Ning-Cheng Lee, as a new addition to the board, has not yet chosen his focus," explained Tickman. Lee was named SMTA Member of Distinction in 2002 and has received several awards, including the Soldertec Global Lead-free Solder Award in 2003, and the 2006 CPMT Exceptional Technical Achievement Award. He serves as an SMTA board member, liaison to the Taiwan SMTA chapter, and coordinator and chair of the 2005 Nepcon Shanghai technical program.

The author of two books and more than 100 technical papers, Lee is an electronics assembly materials expert with experience in solders, fluxes, high-temperature polymers, underfills, and adhesives development. He researches advanced materials for interconnects and packaging for electronics and optoelectronics applications. The CPMT board appointed him to fill a remaining 1-year term. Under normal circumstances Lee would be eligible to serve 2 consecutive terms (6 years); however, due to his late addition to the board, he will be eligible to serve a total of seven consecutive years.

The society is an international forum for scientists and engineers engaged in research, design and development of microsystems packaging and manufacture. The CPMT produces journals, conferences, workshops, chapter events, educational programs and awards. CPMT encompasses materials science, chemical processes, reliability technology, mathematical modeling, education, and training used in the design and production of discretes, hybrids, and electronic packaging fields. They are a volunteer organization. For more information visit www.cpmt.org.

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