SMTAI Summit Addresses Emerging Technologies


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MINNEAPOLIS — New technologies are continuously being implemented into the electronics industry. To stay at the forefront of emerging trends, the SMTA organized the Emerging Technologies Summit, which will take place at SMTA International and Assembly Tech Expo (ATExpo), September, 24–28, 2006, in the Donald Stephens Convention Center, Rosemont, Ill. The summit will include three paper sessions and a panel discussion, all of which will cover trends in electronics manufacturing and assembly.

The session titled "Packaging Space: Nano Outer," will feature:

"Emerging Trends Overview," by Ken Gilleo, Ph.D., ET-Trends LLC "Bonding Techniques in Wafer Fabrication," by Karthik Tondapu, University of Missouri at Columbia "Flip Chip Integration of a Large Format Array of Micro-optoelectrical mechanical systems (MOEMS) Devices for Space Infrared Astronomy," by Christine Allen, J. Abrahams, N. Costen, L. Hess, M. Li, T. Miller, H. Moseley, D. Puckett, J. Pontius, E. Schulte, and C. Zincke, NASA Goddard Space Flight Center "Multiscale Assembly and Packaging System for MOEMS," by Dan Popa, University of Texas – Arlington "Nanotechnology and Room-temperature Assembly," by Alan Rae, Ph.D., NanoDynamics, Inc.Session chair and co-chair are George Riley, Ph.D., FlipChips Dot Com, and Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory, respectively.

Chaired by Steve Greathouse of Intel Corp., and co-chaired by John Tatum, Jabil Circuit, "Wireless Technology," will feature papers highlighting:

"Emerging Opportunities and Challenges for High-frequency Broadband Communications," by Rudy Emrick, Motorola "Connecting the Unconnected – Broadband Wireless Access Technologies," by Xin Meng of Motorola "Network, WiFi, WiMax, WiMedia, WiMe? What Wireless Standards Can Bring to Sensing and Controls," by Kenneth D. Cornett, Motorola.

Chair Ken Gilleo and co-chair Bill Garon of Jabil Circuits will present "Using RFID to Add Value to Your Products and Services," featuring a presentation and demonstration of high-frequency and ultra-high-frequency technologies and applications in PCB product environments. Ed Gonsalves, Philips Semiconductors, will lead the presentation and demonstration.

Technical experts from user and supplier segments within the electronics industry who are actively involved in the development and implementation of emerging technologies will lead the panel discussion. Panelist include:

Advanced Packaging Trends — Steve Greathouse, Intel Corp. Nanotechnology — Alan Rae, Ph.D., NanoDynamics, Inc. Emerging Technologies — Ken Gilleo, Ph.D., ET-Trends LLC Lead-free — Paul Vianco, Ph.D., Sandia National Labs EMS — Irene Sterian, Celestica, Inc. RFID — Ed Gonsalves, Philips Semiconductors Wireless — Presenter is yet to be determined.

For more information on SMTA International and the Emerging Technologies Summit, visit www.smta.org/smtai, or contact JoAnn Stromberg, SMTA executive administrator, at (952) 920-7682 or via e-mail: joann@smta.org.

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