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iNEMI Takes Roadmap Workshop to Shanghai
May 15, 2006 |Estimated reading time: Less than a minute
HERNDON, Va. — The International Electronics Manufacturing Initiative (iNEMI) will hold a 2007 Roadmap workshop in Shanghai, China, in tandem with the High-density Microsystem Design and Packaging and Component Failure Analysis in Electronics Manufacturing (HDP) 2006 conference. Co-sponsored by HDP 2006, the Sino-Swedish Microsystem Integration Tech (SMIT) Center, and the IEEE Components, Packaging, and Manufacturing Technology Society (CPMT), the half-day workshop will take place June 27, 2006, on the Yan Chang Campus of Shanghai University.
At the workshop, which is the first to be held in Asia by iNEMI, attendees will get to preview draft chapters of the 2007 iNEMI Roadmap. Select market segment highlights and six of the 19 areas will be covered, including semiconductors, packaging, board assembly, environmental, organic substrates, and sensors. Discussion and input into the draft chapters will help to ensure inclusion of issues important to Asia-based companies.
For more information about the 2007 Roadmap workshop, please click here, where a preliminary agenda is available with ongoing updates. To register, please visit www.hdp-shanghai.com/.