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WEST WARWICK, R.I. — The Flip-Top ball grid array (BGA) socket series from Advanced Interconnections Corp. develops, tests, and validates 1.00-mm-pitch BGA and land grid array (LGA) devices at speeds up to 2.6 GHz (single-ended). Its compact design requires no soldering of the integrated circuit (IC) and needs no external hold-downs or tooling holes in the PC board.
Available for either thru-hole or surface mount applications, features include tin/lead or lead-free solder ball terminals, an integral finned heatsink or coin screw, and patented spring-pin technology that matches the device footprint. It displays single-ended insertion loss of -.060 dB at 2.6GHz and differential insertion loss of -2.80 dB at 5.0 GHz, with near- and far-end crosstalk values at <5% and <2%, respectively.