IPC, HKPCA Join Forces in Conference

Reading time ( words)

BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries and the Hong Kong Printed Circuit Association (HKPCA) are coming together to produce the first Executive Market and Technology Forum conference, June 13–14, 2006, at the Harbour Plaza Hotel in Hong Kong. Both associations expect more than 100 attendees from the PCB, electronics assembly, and other electronics manufacturing industries.This one-and-a-half-day conference will feature management, market, and technology topics, presented from a strategic perspective by expert speakers. Peter Morgan, chief economist Asia Pacific of The Hong Kong and Shanghai Banking Corporation Ltd. (HSBC), will present a keynote address on economic conditions and forecasts. A closer look at business trends in the electronics industry will follow, presented by Tien Yu Sieh, senior director, equity research analyst and regional technology strategist for Merrill Lynch (Asia-Pacific).Attendees will learn about the latest developments in China's lead-free requirements from Ma Xin, Ph.D., director of the Subcommittee on Lead-free Soldering Technology of the China Welding Society. Anthony Hilvers, IPC's vice president of industry programs, will provide an update on lead-free costs, technology drivers, and deployment. Joan Tourné, advanced technology director at Viasystems, will discuss the latest trends in reliability, functionality, and speed of high-performance PCBs.

The head of Flextronics India, Gururaj A, will cover the emergence of India as an electronics production hub and how it compares with other growing production locations such as China. Speakers from major electronics OEMs, including Nokia, will cover supply chain and sourcing trends.

For more information, please visit www.ipc.org/ExecForumAsia.



Copyright © 2019 I-Connect007. All rights reserved.