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IRVINE, Calif. — The electronics group of Henkel promoted Michael Buckley to Global Product Manager for Die Attach, having served as Senior Technical Service Engineer, supporting packaging customers' die attach processes. Buckley has held various development and engineering positions with different companies over the past 15 years, including formulation and engineering support assistance for conductive inks, dielectric films, and leadframe die attach materials.
In this role, Buckley will oversee product development, sales, and technical service management for Henkel's global die attach business, and will be based in the Irvine, Calif., facility.
Henkel's die attach product line incorporates proprietary Bis-Maleimide (BMI) chemistry, which is said to boost throughput by enabling curing time efficiencies and allowing adhesion to pre-plated surfaces. Also, its polytetrafluoroethylene (PTFE)-filled pastes suit stacked-die applications, where fragile devices must be protected. When developing die attach materials, multiple adhesion surfaces and coatings applied to such surfaces pose characterization challenges; therefore, Buckley's chemical interactions and material sets knowledge is crucial to manage this product line effectively.