IPC Elects Technical Volunteer Chairman

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BANNOCKBURN, Ill. — IPC–Association Connecting Electronics Industries elected Don Dupriest to chairman of the IPC Technical Activities Executive Committee (TAEC), a technical body within the organization focused on technical policy and procedure matters. He succeeds Bob Neves of Microtek Laboratories. All TAEC leaders are industry volunteers, and TAEC members vote to select the TAEC chairperson for a two-year term.

Beginning his career in 1971 at the Integrated Circuits Lab of Lockheed Martin Aeronautics division, Dupriest later became known as an expert in production operations for Lockheed Martin Missiles and Fire Control in Dallas, Texas. In 1984, Dupriest moved to the Missiles division, leading interconnect technology development for electronic manufacturing; and overseeing advanced technology, process development, and product manufacturability for electronic systems.

Dupriest also manages Lockheed Martin's PWB/CCA focus team, a corporate division of the Engineering Process Improvement (EPI) Center (Cherry Hill, N.J.), in which five working groups focus on design, lead-free technology, and sourcing.

TAEC activities include evaluating and approving all standards activities, including revising or developing new standards or forming new subcommittees/task groups; solving conflicts between committees; or addressing issues affecting the standards, such as the use of metric. Dupriest will hold this position through February 2008.

Dupriest has received the IPC Presidents Award, and has been recognized for past work in various task groups. He served as general chairman of the IPC D-30 Rigid Board Committee, and has led task groups for the D-33a Rigid Printed Board Performance (IPC-6012) and D-33d Via Protection specifications. Dupriest holds a patent in flexcable technology, and has a Bachelor of Science in Industrial Technology from the Texas A & M University at Commerce in Commerce, Texas.



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